T1
In-Memory Computing Using Emerging Devices
9:30 - 13:30
ROOM MOZART
CHAIRS
Chang Gao (TU Delft, NL)
Wooseok Choi (IBM, Zurich, CH)
Daniele Ielmini (Politecnico di Milano, IT)
Sugako Otani (Nagoya University, JP)
ABSTRACT
Data-centric machine learning applications are increasingly constrained by the energy and latency costs of moving data between memory and processors. In-Memory Computing (IMC) addresses this von Neumann bottleneck challenge by performing computations directly within memory arrays, paving the way for sustainable AI hardware. This half-day tutorial introduces the broad and interdisciplinary domain of digital/analog AI accelerators using emerging devices and circuits. The tutorial begins with an architectural overview of IMC and Processing-in-Memory (PIM) concepts, followed by an exploration of emerging memory technologies, such as resistive RAM (ReRAM), phase-change memory (PCM), and related device families. The third section focuses on IMC and neuromorphic hardware integrated with circuits and emerging devices. The final tutorial concludes with perspectives on EDA and algorithm–hardware co-design.
PROGRAM
09:30 - 10:15
Introduction to In-Memory Computing: Recent Prototype Chips and Agentic Co-Design Flow
Shimeng Yu (Georgia Tech, Atlanta, US)
This tutorial reviews recent advances in both analog and digital in-memory computing (IMC) using silicon CMOS technologies and emerging memory devices. We begin by introducing the fundamentals of IMC, including key performance metrics and benchmarking methodologies. Next, we present multiple generations of silicon-proven prototype chips, including current-domain IMC based on resistive random-access memory (RRAM) fabricated in a TSMC 40 nm process, as well as current-domain IMC using ferroelectric field-effect transistors (FeFET) implemented on GlobalFoundries’ 28 nm FeFET platform. We discuss the key challenges of analog IMC, particularly accuracy degradation due to process–voltage–temperature (PVT) variations, along with corresponding mitigation techniques. We then motivate the transition toward more robust digital compute-in-memory (DCIM) architectures, exemplified by FeFET-based divider bit cells, and explore more energy-efficient charge-domain IMC paradigms enabled by ferroelectric non-volatile capacitors (nvCap). Finally, we introduce an agentic co-design workflow using ChatNeuroSim, a cross-layer automation framework built upon the widely used NeuroSim platform. This workflow enables systematic optimization of power, performance, and area (PPA) metrics for IMC architectures under given workload and design constraints.
10:15 - 11:00
In-Memory Computing for Trustworthy Edge AI: From Bayesian Methods to On-Chip Learning
Elisa Vianello (CEA-Leti, Grenoble, FR)
The deployment of artificial intelligence (AI) on edge devices requires performing complex tasks under strict energy and latency constraints. This challenge has driven significant interest in in-memory and near-memory computing paradigms, which aim to reduce data movement and improve efficiency. However, beyond efficiency, ensuring the trustworthiness of AI systems remains a critical concern. Conventional neural networks often lack mechanisms to quantify prediction uncertainty, making them vulnerable in safety-critical applications. Bayesian neural networks offer a promising alternative by enabling principled uncertainty estimation. In this context, emerging nanodevices with intrinsic stochasticity can be leveraged to perform Bayesian in-memory computing. By encoding probability distributions at the device level, such approaches naturally provide uncertainty estimates while reducing the overhead associated with deterministic implementations. Another key challenge is the reliance on cloud-based training, where edge devices depend on shared datasets and pre-trained models. On-chip learning addresses this limitation by enabling local adaptation directly on inference hardware, thereby reducing data transfer, enhancing privacy, and improving robustness. This tutorial reviews recent hardware innovations, including hybrid synaptic architectures that decouple inference from learning, as well as algorithmic approaches such as meta-learning, which combine global cloud-based training with efficient on-device adaptation.
11:00 – 11:30
Coffee break
11:30 – 12:15
In-Memory Analog Computing for AI and Neuromorphic Accelerators
Zhong Sun (Peking University, Beijing, CN)
The rapid growth of artificial intelligence (AI), including deep neural networks and large language models (LLMs), is placing increasing demands on computing performance and energy efficiency. Conventional digital processors are fundamentally limited by the von Neumann bottleneck, where data movement between memory and compute units dominates power consumption and latency. In-memory computing (IMC) offers a promising solution by performing computation directly within memory arrays, thereby reducing data movement and enabling massive parallelism.
This tutorial introduces analog and mixed-signal IMC architectures based on emerging resistive memory devices, such as resistive RAM (ReRAM) and phase-change memory (PCM). These devices exhibit two fundamental characteristics—static conductance and dynamic switching—both of which can serve as computing primitives for accelerating AI algorithms. In particular, many AI workloads are dominated by linear algebra operations, such as matrix–vector multiplication and matrix equation solving, which can be naturally mapped onto memristor crossbar arrays using the static conductance states of the devices. This enables highly parallel analog computing with improved energy efficiency for neural network inference and training.
Beyond static conductance, the dynamic switching behavior of memristors provides additional computational capabilities. Device dynamics can be exploited for applications including stateful logic for in-memory acceleration, attractor networks for associative memory, reservoir computing and spatiotemporal signal processing using transient device responses, and biologically inspired spike-timing-dependent plasticity.
This tutorial also highlights the challenges and opportunities in leveraging both static conductance and dynamic switching of resistive memory devices for next-generation AI hardware.
12:15 – 13:00
How Memory Powers Intelligence - From Cognition to AI Systems
Helen Li (Duke University, Durham, US)
As artificial intelligence (AI) continues to scale in power and influence, modern models increasingly mirror the complexities of human cognition. Yet, a widening gap exists between the principles of biological memory and the constraints of contemporary computing systems. This talk explores this intersection through the lens of memory. We present research that reimagines intelligent systems not just as data processors, but as experience-driven learners. Key questions include: How can systems retain and learn from past interactions? How can we prioritize what information is worth encoding? What strategies enable efficient consolidation of long-term knowledge? And how can we accelerate memory retrieval to support real-time reasoning? By drawing parallels between cognitive science and AI architecture, we highlight novel memory-centric approaches to unlocking more intelligent, scalable, and adaptive computing systems.
BIOSKETCHES
Shimeng Yu
Shimeng Yu is the endowed Dean’s Professor of Electrical and Computer Engineering at the Georgia Institute of Technology. He received a PhD degree from Stanford University in 2013. He is an elevated IEEE Fellow for contributions to non-volatile memories and in-memory computing. Prof. Yu’s research interests are semiconductor devices and integrated circuits for AI hardware. Among Prof. Yu’s honors, he was a recipient of National Science Foundation (NSF) CAREER Award in 2016, IEEE Electron Devices Society (EDS) Early Career Award in 2017, ACM Special Interests Group on Design Automation (SIGDA) Outstanding New Faculty Award in 2018, Semiconductor Research Corporation (SRC) Inaugural Young Faculty Award in 2019, IEEE Circuits and Systems Society (CASS) Distinguished Lecturer in 2021, IEEE EDS Distinguished Lecturer in 2022, Intel Outstanding Researcher Award in 2023, and SRC Rama Divakaruni Technical Excellence Award in 2025. Prof. Yu’s 500+ journal/conference publications received more than 40,000 citations (Google Scholar) with H-index 86. Prof. Yu has served as technical program committee for the leading conferences in the field, including IEEE International Electron Devices Meeting (IEDM), IEEE Symposium on VLSI Technology and Circuits, IEEE International Reliability Physics Symposium (IRPS), ACM/IEEE Design Automation Conference (DAC), ACM/IEEE Design, Automation & Test in Europe (DATE), ACM/IEEE International Conference on Computer-Aided-Design (ICCAD), etc. He also has served as an editor for IEEE Electron Device Letters (EDL), and the associate editor-in-chief for IEEE Journal on Emerging and Selected Topics in Circuits and Systems (JETCAS).
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Elisa Vianello
Elisa Vianello is a senior scientist at CEA-Leti. Her primary research interests revolve around the development of new technologies for highly energy-efficient forms of memory-centric computing. In 2022, Elisa was awarded an ERC Consolidator Grant for her research on "Heterogeneous integration of imprecise memory devices to enable learning from a very small volume of noisy data". She has been a member of the VLSI Technical Program Committee (TPC) since 2023. Elisa obtained her Ph.D. in Electrical Engineering jointly from the Università degli Studi di Udine (Italy) and the Grenoble Institute of Technology (INPG, France) in 2010.
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Zhong Sun
Zhong Sun is an Assistant Professor at Peking University, where he has been serving since 2020. He received his Ph.D. from Tsinghua University in 2016 and subsequently worked as a postdoctoral researcher at Politecnico di Milano. His research focuses on developing novel computing paradigms based on resistive memory devices, with publications in Nature Electronics, Nature Communications, Science Advances, and PNAS. He received the Intellectual Property Award (Italy) in 2019, was recognized as a Distinguished Young Scholar by the National Natural Science Foundation of China (NSFC) in 2021, and was named an Intelligent Computing Innovator by MIT Technology Review China in 2022. He is a Senior Member of the IEEE.
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Hai Li
Hai "Helen" Li is the Marie Foote Reel E’46 Distinguished Professor and Chair of the Pierre R. Lamond Department of Electrical and Computer Engineering at Duke University. She received her B.S. and M.S. degrees from Tsinghua University, and her Ph.D. degree from Purdue University. Her research interests include neuromorphic circuits and systems for brain-inspired computing, machine learning acceleration and trustworthy AI, conventional and emerging memory design and architecture, and software and hardware co-design. Dr. Li served/serves as the Associate Editor-in-Chief and Associate Editor for multiple IEEE and ACM journals. She was the General Chair or Technical Program Chair of multiple IEEE/ACM conferences and the Technical Program Committee member of over 30 international conference series. Dr. Li has received many awards, including the IEEE Edward J. McCluskey Technical Achievement Award, Ten Year Retrospective Influential Paper Award from ICCAD, TUM-IAS Hans Fischer Fellowship from Germany, ELATE Fellowship, nine best paper awards, and another ten best paper nominations from IEEE/ACM. Dr. Li is a fellow of IEEE, ACM, and NAI.
